Capabilities
Manufacturing Capabilities
- Quick-turn prototyping (manual & automated)
- Medium to high volumes (automated)
- JIT manufacturing
- Statistical process control
- SMT, and through-hole assemblies, including "mixed technologies"
- Conformal coating services (including urethane, 2-part epoxies, silicon, acrylic and paralyne)
- Rigid and flex pcb's
- Mechatronics Assembly
- Dock to stock builds
Process Capabilities
- No-clean chemistry
- Water soluble chemistry
- RoHS manufacturing
- Ionic contamination testing
- High impedance requirements
- Wave soldering and selective soldering
- Multiple board finishes including HASL, nickel-gold, and immersion tin and silver
- Ball Grid Array (BGA) rework, re-balling and inspection services
- Interconnection and packaging consulting
SMT Assembly Capabilities
- Single-sided component populated boards
- Double-sided component populated boards
- Flexible circuit assemblies
- Fine-pitched components, including QFPs
- Plastic, tape, and ceramic ball grid arrays (BGAs)
- CGA/LGA assemblies
- Chip scale packages
- High-density & complex SMT
- High-density BGAs
- High pin count interconnect
- Direct chip attach
- Chip scale attach
- PCMCIA
Through-hole Assembly Capabilities
- Manual/mechanical
- Semi-automatic insertion
- Component lead forming
- Axial component sequencing
Box Build Capabilities
- Sub-assemblies and complete system assembly
- Full product testing: digital, analog, RF, mixed technologies
- Power supplies
- Full systems integration
- Dock to stock
Cable & Wire Harness Capabilities
- Flat Ribbon Cables
- Grounding Cables
- RF Cable Assemblies
- Fiber Optic Cables
- Wire Harnesses
- Discrete Harnesses
- Power Cords
Testing
- Cable Testing
- Point to point
- Full systems testing
- 'Black Box' Testing
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